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1. Field of the Invention
This invention relates to a passive film formation method for forming passive film such as an insulating film, a dielectric film, and an electrically conductive film on a semiconductor substrate.
2. Description of the Related Art
Various methods, e.g., a glow discharge method, a pyrolytic chemical vapor deposition (CVD) method, and an ion plating method, are used for forming passive films on a semiconductor substrate (wafer). For example, in a conventional ion plating method, an ion plating apparatus is used. The ion plating apparatus 0b46394aab